Template-type: ReDIF-Paper 1.0
Author-Name: Yingying Zhang Zhang
Author-Name-First: Yingying
Author-Name-Last: Zhang Zhang
Author-Email: yzhang@iuj.ac.jp
Author-Workplace-Name: IUJ Research Institute, International University of Japan
Author-Name: Sylvia Rohlfer
Author-Name-First: Sylvia
Author-Name-Last: Rohlfer
Author-Workplace-Name: CUNEF University
Title: Cultural Configurations for International Innovativeness: A review and theoretical proposal
Abstract: The accelerated international business context with the multiple sourced dynamic factors such as technology, emerging market rules and COVID-19 alike crisis demands innovativeness to survive and sustain competitive advantages. Culture as a complex construct adds complications to the international business, but may also provide a response as a soft organizational element. In this paper we explore the relationship between two the culture and innovation with systematic literature review to identify cultural configurations in affecting innovation. We deployed quality social science citation indexed journal publications identified in the Web of Science (WoS) database with a set of keywords. The identified search results were reduced to 697 articles from an initial 7,097 items with inclusion and exclusion criteria. Utilizing Python machine learning tools and PHP language scripting, we clustered 697 items into 7 topic groups with 94 keywords spotted. We further analyze the seven clusters, with a comprehensive theoretical framework to unfold the underlying influences of culture on innovation in an international business context. Research gaps are also recognized for future research directions.
Length: 38 pages
Creation-Date: 2023-04
Number: EMS_2023_05
File-URL: https://www.iuj.ac.jp/workingpapers/index.cfm?File=EMS_2023_05.pdf
File-Format: Application/pdf
File-Function: First version, 2023
File-Size: 1272KB
Keywords: Cultural distance, corporate culture, national culture, innovation, knowledge, R&D, globalization, creativity, new product development, multinationals
Handle: RePEc:iuj:wpaper:EMS_2023_05